Products
Ag sintering paste/film
Pressure sintered silver bonding material with excellent heat dissipation and high temperature reliability, used for power semiconductors and power modules bonding in electric vehicles.
Core Competitiveness
– Paste
- Excellent print quality
- Easy to store and use (under 0°C in the refrigerator)
- High bonding strength
– Film
- Excellent transfer properties
- High bonding strength
Application
- Power Modules for EVs
ASI series (Silver nano ink)
Silver nano-ink with excellent dispersion and jetting stability through the use of ultra-fine particles (15-20 nm).
Core Competitiveness
- Use of seconds (15-20 nm) fine particles
- Superior dispersibility
- Jetting stability
- Physical stability
Application
- Digitizer FPCB, bezel electrode for touch panel, NFC antenna electrode, etc.
ACS series (Copper nano paste)
Utilizing the light sintering process, it is applied to a variety of FPCB products that require low-cost fine line width printing.
Core Competitiveness
- 광The photonic sintering process ensures that sintering can take place in an atmospheric environment at room temperature without any reoxidation reaction.
- Excellent adhesion to flexible substrate, low specific resistance, ultra-fine pattern printable
Application
- Digitizer FPCB, bezel electrode for touch panel, NFC antenna electrode, etc.
