Nano-Thin Film

Thin Film Substrates
FPCB

Thin Film Substrates

Product Name : COF(Chip On film), DCOF(Digitizer)

Product Introduction (Function)

It is a circuit that connects the driver and main circuit board of the display panel that is installed to smartphones TVs, and the fine circuits are comprised on one side or both sides.

Core Competitiveness (Features)

  • Prevention of any leakages between the fine pitches through applying an alloy seed
  • The enhancement of the peel strength through surface modification and the optimization of the seed width
  • Excellent reliability is achieved due to the simplification of the Via process (2-metal)
  • Improvement of circuit density and uniformity through the ‘Z’ Process (Thin PR Thickness)

Application

Application to high-resolution displays such as FHD and UHD and mobile devices

Product Name : Metal Mesh (TSP), Transparent Antenna

Product Introduction (Function)

The transparent metal mesh electrode that has overcome the limitations of the oxide-based ITO transparent electrode.
It is applied as a touch screen of the large area flexible display due to its high conductivity and flexibility, and this thin film PCB complete with excellent conductivity can further expand its use for transparent shielding, a transparent antenna, and a transparent heater.

Core Competitiveness (Features)

  • Metallization technology for a range of film materials including the optical PET, PEN, transparent PI, etc.
  • Securement of the manufacturing technique for darkening thin metal film that is applied with the Roll to Roll sputtering
  • Formation of the 1um thick sensitive film that applied the Micro-Coating and realization of the mesh with a 1~2um line width

Application

  • The transparent electrode of the large area touch screen panel, and bendable & foldable display over 15 inches
  • Transparent shielding film: Shielding for home appliances, noise shielding for IT devices, electromagnetic wave shield window
  • Transparent antenna: Mobile antenna, Touch screen panel + antenna module, antenna for automotive

Product Name : RF Jumper Flex(FPCB type RF Cable)

Product Introduction (Function)

The multi-layer PCB for high frequency that has applied a low loss new material and a one-step lamination process to cope with the next generation mmWave (5G) communication

Core Competitiveness (Features)

  • Securement of the low loss film material technology that has a self-adhesion function (CX material – intermediate temperature, CE material – low temperature)
  • Application of low dielectric X material film, and the thin film patterning technology for the inner layer film
  • The new stack process technology having high precision that is applied with a one-step lamination process
    (The technology that substitutes the build-up process that is applied to the existing multiple layer FPCB production)

Application

  • A substitution PCB for the coaxial cable that transmits high frequency from the inside of smartphones
  • A thin film multi-layer PCB for tracks to transmit the 5G wireless communications module
  • A circuit board for an antenna with high-frequency arrays, and a multiple layer substrate for the AIP module

FPCB

Product Name : FPCB for NFC Wireless Charging

Product Introduction (Function)

It is used as a circuit component that can realize the near field communication technology which is considered to be suitable for IoT and wireless technology which can transmit electricity without using any electric wires

Core Competitiveness (Features)

  • Securement of the patterning technology ideal for thick and fine circuit to attain the desirable level of efficiency for high power
  • Securement of price competitiveness and the distribution and procurement stability based on factory management for product assembly processes around the local factories of clients

Application

  • A wireless charging system for cellphones and electric
  • Medical device, Home appliances