Nanoparticle

Nano Powder
Nano Ink

Nano Powder

Product Name : 20nm-size Silver Nanoparticle

Product Introduction (Function)

AMOGREENTECH manufactures silver nanoparticles by using an electrolytic method that is similar to the existing liquid phase reduction method, and the silver nanoparticles are 20nm in size on average and have an extremely narrow distribution map.
Also, we have finally overcome the difficulties of using the electrolytic method which previously meant that we could not synthesize silver nanoparticles with a high yield, but it has now become possible to perform mass production of the product.
Based on such particle synthesis know-how, AMOGREENTECH has been providing competitive silver nanoparticles that are specifically suited to the ink-jet & EHD printing.

Core Competitiveness (Features)

  • Ultrafine particles(20nm/50nm)
  • Narrow particle-size distribution
  • Mass production
  • Physical stability

Application

The production of conductive ink for printing electronics (ink-jet printing, EHD printing)

Nano Ink

Product Name : ASI series (Silver Nano Ink)

Product Introduction (Function)

It has an outstanding dispersion stability, and the use of ultrafine particles (15~20nm) prevents any blockages when jetting, while the high content of silver can reduce the number of printing.

Core Competitiveness (Features)

  • Use of ultrafine particles (15~20nm)
  • Excellent dispersibility
  • Jetting stability
  • Physical stability

Application

The expanded application is possible to the digitizer FPCB, bezel electrode for touch panels, NFC antenna electrode, RFID tag antenna electrode, etc.

Product Name : ACI series (Copper Nano Ink)

Product Introduction (Function)

The use of the photonic sintering process allows the application of the product to various FPCB products that require low costs and printing with a fine line width.

Core Competitiveness (Features)

  • Excellent dispersibility
  • Jetting stability
  • Physical stability

Application

The expanded application is possible to the digitizer FPCB, bezel electrode for touch panels, NFC antenna electrode, RFID tag antenna electrode, etc.

Product Name : ACS series (Copper Nano Paste)

Product Introduction (Function)

The use of the photonic sintering process allows the application of the product to various FPCB products that require low costs and printing with a fine line width.

Core Competitiveness (Features)

  • The photonic sintering process ensures sintering can occur in the room temperature atmospheric environment without any reoxidation reaction
  • An outstanding adhesion intensity with a flexible substrate, low resistivity, and the printing of extra fine patterns are all possible

Application

The expanded application is possible to the digitizer FPCB, bezel electrode for touch panels, NFC antenna electrode, RFID tag antenna electrode, etc.